MediaTek has introduced Dimensity 7200 and Dimensity 7000 series. This chipset is designed for mid-range 5G smartphones and focuses on enhanced gaming and photography. It follows the Helio G36 SoC that the chipmaker recently introduced at an affordable price. Here are some details.
MediaTek Dimensity 7200 Features and Details
In addition to the flagship Dimensity 9200 SoC, the Dimensity 7200 chipset is also based on TSMC’s 4nm second-generation process. With two Arm Cortex-A715 cores that can clock at 2.8GHz and six Cortex-A510 cores, the octa-core CPU has a Mali-G610 MC4 GPU.
The chipset supports MediaTek HyperEngine 5.0 technology, which enables AI-based Variable Rate Shading (VRS), CPU and GPU smart resource optimization, and more to save power and accelerate gaming performance.
There is an HDR-ISP 14bit and the MediaTek Imagiq 765 to enhance your photography needs. With these features, the Dimensity 7200 supports up to 200MP cameras, 4K HDR videos, all-pixel autofocus technology, video recording via both the rear and front cameras simultaneously, Motion Compensated Noise Reduction for enhanced low-light captures, AI-Camera enhancements, and more.
The SoC can support a Full HD+ screen resolution, 144Hz refresh rate, and HDR10+. In addition to AI SDR-to-HDR video playback, the Dimensity 7200 SoC provides 2CC Carrier Aggregation, dual 5G SIM cards with dual VoNR, and triband Wi-Fi 6E. A 5G UltraSave 2.0 technology and 3GPP Release-16 standard Sub-6GHz 5G modem are also included in this device.
In addition to Bluetooth LE Audio, dual-link true wireless stereo audio, and UFS 3.1 storage, the MediaTek Dimensity 7200 chipset will be available in 5G devices by Q1, 2023. The names of the smartphones have not yet been revealed, so stay tuned for updates.