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Apple iPhone SE teardown reveals hardware similar to iPhone 6s, 5s

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Even though many Apple fans around the world have not a chance to get their hands on the company’s new 4-inch iPhone, ChipWorks seem to have already ripped apart the device and offers details on what exactly is powering it.

Starting with the processor, it has been pointed out that the promised A9 does indeed appear to be the same found in the iPhone 6s. The processor has been made by TSMC . The device houses the 2GB RAM, again used on the iPhone 6s. The report points out that the date of this part according to labelling is around August or September of 2015, meaning that it has been sitting around in inventory since then, and was likely originally intended for the iPhone 6s.


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Apple is sported using the Broadcom BCM5976 and Texas Instruments 343S0645 in the iPhone SE. This solution has reportedly been used in the iPhone 5s and iPods over the past few years. It has also been used in the MacBook Pro, MacBook Air, and iPad Mini.

The iPhone SE includes NXP 66V10 for NFC which includes two die, the Secure Element 008 and the NXP PN549. According to the report, the 6-axis inertial sensor (x, y, z, roll, pitch, and yaw) is an InvenSense 6-axis sensor constructed from two die, the ASIC and the MEMS sensor. Toshiba has also made the 16GB flash chip found in this iPhone, which is a new chip respectively.

Chipworks says, “While there is still much to discover about this new iPhone, what is becoming clear is that this is not your typical Apple release. As is the genius of Apple and its fearless leader, Mr.

Cook, it is the combination of all the right parts that make a successful product. Finding that just-right balance of old and new, and at such a low cost, is no easy feat.”

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